The
pin grid array or
PGA is a type of packaging used for
integrated circuits, particularly
microprocessors. The integrated circuit (IC) is mounted in a
ceramic slab of which one face is covered, or partially covered, in a sqaure array of metal pins. The pins can then be inserted into the holes in a
printed circuit board and
soldered in place. They are almost always spaced a tenth of an inch (2.54 mm) apart. For a given number of pins, this type of package occupies less space than older types such as the dual-in-line package (DIL or DIP).